Huawei Technologies has shipped more than 100 million devices powered by its Kirin processors since 2023, when it returned to the smartphone market with a new generation of premium handsets. The company says testing of its next-generation Kirin 2027 chip is also progressing in line with expectations.
The company disclosed the figure on Tuesday as it unveiled new details about its flagship Kirin 9050 series, the first mass-produced chip using its proprietary LogicFolding architecture, developed under a framework it calls the Tau Scaling Law.
Huawei said the new chip design integrates more than 50 million hybrid bonds and improves transistor density by 53.5 per cent. “The Kirin 9050 series has successfully achieved mass production with the support of China’s domestic electronics supply chain,” the company said.
Chinese media outlet Yicai reported on Tuesday that Huawei had also begun testing its next-generation Kirin 2027 processor, with preliminary results meeting the company’s targets. The report cited Xu Songyu, a director responsible for wireless device chips at Huawei’s semiconductor business.