Intel is collaborating with Chinese artificial intelligence (AI) start-up ModelBest and auto chip designer Black Sesame Technologies to deploy an in-vehicle large language model (LLM) and advanced central compute platform, respectively, in intelligent connected cars.
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The strategic partnerships were announced on Wednesday at the opening of the 10-day Shanghai Auto Show, where the US semiconductor giant made its debut to unveil the second-generation, AI-enhanced software-defined vehicle (SDV) system-on-a-chip (SoC), which it said would provide automakers with “scalable performance, advanced AI capabilities and optimised cost efficiency”.
“Together with our partners, we’re solving real industry challenges – from energy efficiency to AI-driven experiences – to make the software-defined vehicle revolution a reality for all,” Intel Fellow and vice-president Jack Weast, who serves as general manager of Intel Automotive, said at the event.
Intel’s collaborations with ModelBest and Black Sesame reflect growing demand in China – the world’s largest electric vehicle (EV) market – for more computing power in increasingly sophisticated cockpits, as US semiconductor rivals Nvidia and Advanced Micro Devices ramp up their efforts in the auto chip market segment.
That initiative followed Intel’s decision last year to move the headquarters of its automotive unit to mainland China and relocate Weast to Beijing.
According to Intel Automotive, its SDV SoC and Arc graphics processing unit (GPU) are expected to power the deployment of ModelBest’s AI-powered graphical user interface (GUI) intelligent agent to bring in-vehicle LLMs to life. LLMs are the technology underpinning generative AI services like ChatGPT.